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AVIZ Assembly Heating PCB Separation System for Low-stress Board Separation

Assembly Heating PCB Separation System for Low-stress is specified around Separation Low-stress Board needs, helping AVIZ compare cycle time and panel design for a practical RFQ.

8 Technical informationRFQ Specifications by request

Technical information

ModelAVIZ-5700
Product typePCB separation item
Product groupPCB and PCBA depaneling
Process rolepanel-separation method selection and downstream flow planning
Integration pointdownstream assembly and final-board handling
Selection basispanel design, stress sensitivity, cutting method and cycle time
Commercial statusPricing and availability on request
RFQ focusfactory utility planning

Key benefits

  • Ties Assembly Heating PCB Separation System for Low-stress Board Separation selection to cycle time, panel design and stress sensitivity
  • Documents factory utility planning before RFQ release
  • Supports controlled board separation after assembly
  • Helps compare routing, V-cut, and blade-based methods

Applications

  • PCB separation item selection for Separation Low-stress Board
  • controlled PCB and PCBA separation projects needing factory utility planning
  • PCBA depaneling
  • Router cutting

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